European Union awards €1.4 million Eurostars funding for BizEsp's innovative ultra-fine ball grid array sphere (BGA) technology

15th May 2009 - Oxford, UK. BizEsp Limited announced today that it has led and won a €1.4 million grant from the European Union's Framework 7 programme Eurostars for its innovative new ultra-fine ball grid array (BGA) sphere technology. The project due to start shortly will also involve partner companies from Greece and Poland in a value chain assembled for the future manufacture of BizEsp's BGA production lines

Announcing the grant award, CEO Dr Dosten Baluch said "we are absolutely delighted to have won this prestigious Eurostars award which is open to competition from across Europe and is intensely competitive. It is, therefore, an excellent achievement for us and our European partners to have won this grant. This project will give Europe an edge in ultra-fine BGA technology, so essential for high end electronics manufacturing.

Ball Grid Array (BGA) technology simultaneously addresses the need for high density electrical interconnection and physical attachment of silicon chip devices. It employs a 2-D array of miniature solder alloy spheres under the silicon chip to provide both electrical connection and mechanical attachment to a mounting socket or circuit board. Currently, the smallest BGA spheres available on the market have diametre in the range 200-300 microns with some Japanese companies claiming to offer down to 150 microns. The BizEsp Eurostars project will deliver technology for BGA spheres down to 100 microns.